Power for the AI era, delivered vertically.
PowerTile™ moves power conversion directly beneath the processor. One tile replaces more than 33 power ICs, shortening the path current travels and cutting the loss that comes with it.
1,000 A
per chip
1.68 mm
tile height (20 x 24 mm)
33+
power ICs replaced
Recognised by
What a shorter power path gives you
Improved efficiency
Over 85% reduction in board power loss, by cutting the distance current travels.
Increased power density
More amps per mm² delivered straight to GPUs and CPUs.
Thinner form factor
At 1.68 mm, PowerTile fits under the processor and into future AI roadmaps.
Efficiency and sustainability
Lower losses mean lower energy bills for hyperscalers and fewer greenhouse gas emissions.
Smoother data centre demand
Eases the transition to new energy supply expected later this decade.
Scales with the processor
A modular architecture that scales beyond 10,000 A as compute grows.
“[AmberSemi] is entirely on target… a 1,000-amp device… directly under the processor… targets one of the ugliest hidden costs in AI racks: voltage drop & wasted power between the rack input & the chip.”
Mark Vena, Datacenter Knowledge, January 2026 (paraphrased)
Startups like Amber are helping to close the power-management gap that AI workloads have opened up.
Venture Burn, March 2026 (paraphrased)
The growing data centre energy crisis
AI is pushing data centre energy demand faster than new supply can come online. This paper sets out the scale of the problem and why power architecture inside the rack has to be rethought.